CFP15 封裝肖特基二級管在微型化charger设计

精彩问答

[ 最近 10 条问答 ] [ 全部发言 ]
[问：lpgoal]	CFP15能用在快速充电中么
[答：martinhsu]	It is dependence on the fast charger spec requirement	[2014-7-17 10:19:12]
[主持人：ChinaECNet]	各位网友大家上午好，欢迎参加中电网在线座谈，今天我们邀请到NXP的专家，与大家共同探讨“CFP15 封裝肖特基二級管在微型化charger设计”，欢迎大家踊跃提问！	[2014-7-17 10:19:24]
[主持人：ChinaECNet]	各位网友，现在我们已经进入问答环节，如果您想重复观看刚才播放的演讲内容，请点击页面上方的“在线演示”。	[2014-7-17 10:19:48]
[问：zhangjshl]	请问：工作温度是多少？
[答：martinhsu]	Tj(max) is 150deC.	[2014-7-17 10:24:10]
[主持人：ChinaECNet]	各位网友，今天参加问答的专家人数较少，回答问题的速度会比较慢一点，请大家耐心等待，谢谢！	[2014-7-17 10:24:24]
[问：zhangjshl]	反向恢复时间是多少？
[答：martinhsu]	It is 16nS typical	[2014-7-17 10:26:05]
[问：stu_deepblue]	最大电流有多大的
[答：martinhsu]	Currently our product support 10A and 15A.	[2014-7-17 10:26:52]
[问：hjb85]	反向恢复时间需要多久？
[答：martinhsu]	It is 16nS typical.	[2014-7-17 10:27:36]
[问：liang-1011]	最大支持多大持续电流？
[答：martinhsu]	We have two type support 10A and 15A.	[2014-7-17 10:28:08]
[问：joiny]	CFP15封裝的优势有哪些？
[答：martinhsu]	higher thermal performance and smaller dimension	[2014-7-17 10:28:51]
[主持人：ChinaECNet]	各位网友，现在我们已经进入问答环节，如果您想重复观看刚才播放的演讲内容，请点击页面上方的“在线演示”。	[2014-7-17 10:29:53]
[问：jwdxu2009]	性价比如何，
[答：martinhsu]	cost effective with high performance	[2014-7-17 10:30:04]
[问：hjb85]	内部采用什么材料？
[答：martinhsu]	It is used the clip bonding technolog to instead of the normal wire bonding.	[2014-7-17 10:31:02]
[问：hc0814]	有几种封装
[答：martinhsu]	The CFP15 package is optimize for Low Power Adapter 10W ~15W application.	[2014-7-17 10:35:31]
[问：jackson2005]	使用CFP15封装肖特基在PCB布联机需注意什么?以便可以发挥其底部散热片功能?
[答：martinhsu]	As big as possible for the thermal pad size to increase the let the heat dissipate through the PCB well.	[2014-7-17 10:37:12]
[问：zh_angei]	哪有详细资料下载最低工作温度是多少谢谢
[答：martinhsu]	The minimum temperature is -65deC.	[2014-7-17 10:38:31]
[问：jackson2005]	使用CFP15封装肖特基可以增加多少效率?有无实测数据支持?
[答：martinhsu]	The CFP15 is high C/P value solution for cost and performance point of view.	[2014-7-17 10:41:03]
[问：木子鱼]	工作最大频率是多少？
[答：martinhsu]	It is really dependence on application.	[2014-7-17 10:44:02]
[问：cquwuqiang]	不外加加散热器，慢负荷工作器件温升是多少？
[答：martinhsu]	It is dependence on the PCB PAD size.	[2014-7-17 10:45:37]
[问：jackson2005]	有无实际应用例?使用NXP的产品及其它牌产品有多少差异?
[答：martinhsu]	NXP CFP15 offer the same performance with other vendors but higher quality performance.	[2014-7-17 10:46:31]
[问：zhangjshl]	请问：由于体积很小，对PCB布线有何特殊要求？
[答：martinhsu]	As bigger as possible for the pad to get better thermal performance.	[2014-7-17 10:47:11]
[问：hjb85]	是否有针对低VF和低IR进行优化？
[答：martinhsu]	Yes , the Vf and Ir is the most important parameters for schottky diode device.	[2014-7-17 10:47:55]
[问：hjb85]	是否可以支持光学焊点检查？
[答：martinhsu]	Yes !	[2014-7-17 10:48:32]
[问：jackson2005]	Vr50V可以用在多少V的LPA?同样的Vr45V为何?
[答：martinhsu]	Normally it is used for 5v uotput adapter , 50v Vr could get more design margin.	[2014-7-17 10:49:23]
[问：qditz]	CFP15都支持哪些平台或者协议，可以二次开发？
[答：martinhsu]	The CPF15 is not only for LPA application but also for other application like the back drive protection...etc.	[2014-7-17 10:50:22]
[问：tobn]	正常工作最高温度范围?设计中需要考虑散热问题?
[答：martinhsu]	The maximum Tj is 150deC.Thermal is very important design point.	[2014-7-17 10:51:09]
[问：jackson2005]	NXP有"higherqualityperformance",可否具体说明?谢谢!
[答：martinhsu]	It is base on our fail return rate experience !!	[2014-7-17 10:52:05]
[问：cntszxb]	正向压降最小多少？
[答：martinhsu]	For PMEG45U10EPD , Vf=422mV(typ)@If=10A	[2014-7-17 11:20:10]
[问：zendy]	抗干扰怎么处理
[答：martinhsu]	It is related to the layout and Trr performance.	[2014-7-17 11:21:06]
[问：jackson2005]	Solderability与散热性能关系非常紧密.请问要如何测试及检查确认?
[答：martinhsu]	It is related to factory test criteria , it is normally use the X-inspection to check it.	[2014-7-17 11:23:05]
[问：iwqtthf]	CFP15 封裝肖特基二級管相对于其他器件有哪些新特性?
[答：martinhsu]	bigger thermal pad to achieve the better thermal performance	[2014-7-17 11:23:52]
[问：jackson2005]	正常NXP的failreturnrate是多少?相比其竞争厂商有多大优势?
[答：martinhsu]	Sorry , it is confideintial , I can not release the data.	[2014-7-17 11:24:32]
[问：jackson2005]	有更高电压及更高电流的开发计划?
[答：martinhsu]	Yes , we will release higher voltage and current device in the future.	[2014-7-17 11:24:59]
[问：qihongbj]	有数据手册吗？
[答：martinhsu]	Pls download the datasheet from NXP website. Thanks !	[2014-7-17 11:25:25]
[主持人：ChinaECNet]	各位网友，由于时间的关系，今天的座谈会在11:30结束，请大家抓紧时间提问。	[2014-7-17 11:26:04]
[问：jackson2005]	有无标准的PCB布线指导可供参考?
[答：martinhsu]	We just provide the footprint recommandation , the layout is really dependence on the design.	[2014-7-17 11:26:37]
[问：tobn]	肖特基二级管产品的规格大小参数是如何的?
[答：martinhsu]	The shottky diode key parameter are the Vf , Ir and Trr.	[2014-7-17 11:27:29]
[问：cy301]	有哪些新技术新应用
[答：martinhsu]	The package is used the clip bonding technology to instead of the normnal wire bonding.	[2014-7-17 11:28:11]
[问：lpgoal]	散热需要哪些特别处理
[答：martinhsu]	As bigger as possible for the pad to get better thermal performacne.	[2014-7-17 11:28:40]
[问：hjb85]	在结构原理上与PN结二极管有什么区别？
[答：martinhsu]	The most difference is the Vf , so shottky designed more mobility for the electronic , electronic hole to achieve the low Vf performance.	[2014-7-17 11:31:27]
[主持人：ChinaECNet]	各位网友，今天的座谈到这里就结束了，感谢大家参与。	[2014-7-17 11:35:33]
[ 最近 10 条问答 ] [ 全部发言 ]

在线座谈

关于本次座谈

座谈简介

专家介绍

精彩问答

当前状态: 座谈已结束
查看回放